MIL-M-8555C
3.8.14 Modularization. To the extent practicable, the detail design of
the interior electronic arrangements, assemblies and subassemblies shall
incorporate the modularization concept commensurate with the state of the art,
and shall include accessible test points to facilitate location of faulty
modules. Faulty modules shall be removable without major disassembly of the
missile. Modules shall be provided with adequate test points to facilitate
their maintenance.
3.8.15 Standards of manufacture for electronic equipment. Fabrication of
electronic equipment shall be in accordance with MIL-E-8189.
3.8.15 Mechanized production (Including printed circuits). Mechanized
production (including printed circuits) shall be in accordance with MIL-E-8189,
unless otherwise specified herein.
3.8.17 Computer design. The design of embedded computer elements shall
comply with the requirements of AR-106. All microprocessors incorporated In
the missile shall be designed to utilize an identical microinstruction set and
format. Computers and computer elements shall be designed to be compatible
with government furnished equipment (GFE) to be included in the missile.
3.8.18 Computer software desiqn. Computer software for programming,
operating, testing, or supporting the embedded computer shall be designed in
accordance with MIL-STD-1679 to efficiently utilize the hardware to meet
performance requirements. The computer firmware shall also be designed,
documented and tested in accordance with the computer software requirements of
this specification and MIL-STD-1679.
3.8.19 Computer documentation. The following computer documents shall be
prepared in accordance with MIL-STD-1679:
a.
Interface Design Specification (IDS).
Program Performance Specification (PPS).
b.
c.
Program Design specificaton (PDS).
Program Description Document (PDD).
d.
Data Base Design Document (DBD).
e.
f.
Program Package Document.
Operator's Manual (OM).
g.
h.
System Operator's Manual (SOM).
i.
Software Quality Assurance Plan.
Software Configuration Management Plan (SOIP).
j.
k.
Software Development Plan.
l.
Software Change Proposal (SCP)/Software Enhancement Proposal
(SEP).
m.
Computer Software Trouble Report (STR).
3.9 Subsystems and major components of each subsystem.
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